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[Tektronix Power Supply Design and Testing]To Engineers Series Three: Eight Steps to High Efficiency GaN Power Supply Design, Tektronix Series Video Classroom Practice Cheats

[Tektronix Power Supply Design and Testing]To Engineers Series Three: Eight Steps to High Efficiency GaN Power Supply Design, Tektronix Series Video Classroom Practice Cheats

Wide-bandgap semiconductors (SiC and GaN) are now used alongside traditional silicon in demanding applications such as automotive and RF communications due to their ability to operate at higher frequencies, voltages and temperatures with lower power losses. With improved efficiency, safe and precise testing of Si, SiC and GaN devices brings power semiconductor devices to market faster and minimizes failures in the device field.

Hand in hand, take you to decipher GaN power design

Author: Tektronix

Wide-bandgap semiconductors (SiC and GaN) are now used alongside traditional silicon in demanding applications such as automotive and RF communications due to their ability to operate at higher frequencies, voltages and temperatures with lower power losses. With improved efficiency, safe and precise testing of Si, SiC and GaN devices brings power semiconductor devices to market faster and minimizes failures in the device field.

In order to help design engineers clarify many details in the design process, Tektronix and power industry experts jointly launched an 8-session series of live courses on “GaN power supply design from entry to mastery”. It is divided into eight lectures, fully deciphering the power supply design from 0 to 1, and leading engineers to design a high-efficiency GaN power supply completely, including component selection, circuit design and PCB layout, circuit testing and optimization skills, and design of magnetic components. and optimization, loop analysis and optimization, energy efficiency analysis and optimization, EMC optimization and rectification techniques, reliability assessment and analysis.

[Tektronix Power Supply Design and Testing]To Engineers Series Three: Eight Steps to High Efficiency GaN Power Supply Design, Tektronix Series Video Classroom Practice Cheats

The first step: component selection

For engineers, GaN components have many differences and advantages compared to traditional MOSFETs, but they also bring certain design challenges. The course starts from the comparison of the characteristics of silicon, gallium arsenide, silicon carbide and gallium nitride materials, and tests and analyzes the characteristics of gallium nitride by testing Infineon GaN devices with Tektronix instruments.Solution configuration: oscilloscope MSO5 + optical isolation probe TIVH08 + voltage and current probe + power supply and IGBT town software

Step 2: Circuit Design and PCB Layout

Engineers have to choose between various design rules, but also take into account performance, process, cost and other aspects. Circuit design and PCB LAYOUT are often difficult problems for many engineers. The course is based on gallium nitride circuit design and PCB LAYOUT to conduct in-depth discussion and analysis, detailing the differences between gallium nitride and traditional MOSFET design, and PCB LAYOUT related matters needing attention.

Step 3: Circuit Testing and Optimization Tips

Through debugging from low voltage to high voltage, from low frequency to high frequency, from control signal to main circuit operation, from open loop to closed loop, etc., the combination of physical measurement and theoretical analysis provides engineers with clear optimization ideas. Solution configuration: Parametric waveform recorder PCT or Source Sheet 2410 + kickstart software.

Step 4: Design and Optimization of Magnetic Components

The research on LLC resonant converters based on GaN devices not only analyzes the basic topology and principle of LLC resonant converters with GaN devices, but also introduces in detail the improvement of the performance of resonant converters by GaN devices. The resonant Inductor and main transformer were designed according to the resonant frequency by the converter model, and the magnetic analysis was performed by the Tektronix oscilloscope. Scheme configuration: oscilloscope MSO56+5-PWR+power probe.

Step 5: Loop Analysis and Optimization

A stable feedback loop is very important for switching power supplies. This live broadcast will bring you the function of the feedback loop in the system, and introduce the requirements of system stability and the performance indicators of the system in practical applications in detail, highlighting the compensation network. importance, as well as a detailed explanation of commonly used compensation networks and the steps for designing them. Solution configuration: oscilloscope MSO54+AFG option+5-PWR+signal injector J2100A+2 1X probes.

Step 6: Energy Efficiency Analysis and Optimization

The existence of transient interference (EMS) and its impact on Electronic equipment are introduced in detail, followed by quantitative calculation and analysis of key EMI waveforms; Through the combination of theory and actual measurement, it brings engineers a wonderful EMI optimization and rectification skills. Scheme configuration: PA1K/3K+PWRview software.

Step 7: EMC Optimization and Correction Skills

In addition to the description of the power supply concept, the power supply test specifications are also introduced according to national standards. The purpose, equipment, environment, method and calculation of main parameters of power supply energy efficiency test are explained in detail. And by optimizing transformers, semiconductors, PFC circuits, primary converters and secondary circuits to improve product energy efficiency. Solution configuration: RSA spectrum analyzer + EMCvu + probe.

Step 8: Reliability Assessment and Analysis

The reliability of the three power sources is mainly divided into: 1) According to the electromagnetic compatibility reliability EMC, various factors affecting EMS and EMI are explained; 2) The mean time between failures of the power supply MTBF, the concept and practical significance of MTBF are explained in detail and calculation process, as well as important indicators for evaluating MTBF; 3) PCB LAYOUT reliability: give certain design advice and guidance for the three aspects of PCB copper foil, component orientation, and the impact of SMD components on PCB LAYOUT reliability. and related precautions. Solution configuration: digital multimeter DAQ6510+Kickstar software+thermocouple.

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